Imikoreshereze ya Foyide y'umuringa mu gupfunyikamo Chip

Ifosholo y'umuringaIri kugenda irushaho kuba ingenzi mu gupakira chip bitewe n'ubushobozi bwayo bwo gutwara amashanyarazi, ubushobozi bwo gutwara ubushyuhe, uburyo bwo gutunganya, ndetse n'uburyo ihendutse. Dore isesengura rirambuye ry'ikoreshwa ryayo mu gupakira chip:

1. Guhuza insinga z'umuringa

• Gusimbuza insinga za zahabu cyangwa aluminiyumu: Ubusanzwe, insinga za zahabu cyangwa aluminiyumu zakoreshejwe mu gupfunyika insinga kugira ngo zihuze amashanyarazi imbere ya insinga n'insinga zo hanze. Ariko, bitewe n'iterambere mu ikoranabuhanga ryo gutunganya umuringa no kwitabwaho ku giciro, insinga z'umuringa n'insinga z'umuringa bigenda biba amahitamo asanzwe. Uburyo amashanyarazi ya Copper atwaramo amashanyarazi buri hagati ya 85-95% n'aya zahabu, ariko igiciro cyayo kiri hafi kimwe cya cumi, bigatuma iba amahitamo meza yo gukora neza no kunoza ubukungu.
• Imikorere y'amashanyarazi yongerewe: Guhuza insinga z'umuringa bitanga ubushobozi bwo kudakora neza no gutuma ubushyuhe burushaho kwiyongera mu gukoresha ingufu nyinshi n'amashanyarazi menshi, bigabanya neza igihombo cy'amashanyarazi mu mikoranire y'ibyuma no kunoza imikorere y'amashanyarazi muri rusange. Bityo, gukoresha icyuma gifunga umuringa nk'igikoresho gikwirakwiza ingufu mu mikoranire bishobora kongera imikorere myiza no kwizerwa mu gupfunyika hatabayeho kongera ikiguzi.
• Ikoreshwa muri Electrode na Micro-Bumps: Mu gupfunyika uduce duto tw’amashanyarazi, uduce duto tw’amashanyarazi dupfunyika ku buryo uduce tw’amashanyarazi twinjira/sohoka (I/O) turi ku buso bwatwo duhuzwa neza n’uruziga ruri ku gice cy’amashanyarazi. Agapapuro k’umuringa gakoreshwa mu gukora electrodes na micro-bumps, bipfunyikwa ku gice cy’amashanyarazi. Ubudahangarwa buke bw’ubushyuhe n’ubushobozi bwinshi bw’umuringa bituma ibimenyetso n’imbaraga byoherezwa neza.
• Kwizerwa no gucunga ubushyuhe: Bitewe n’uko irwanya cyane amashanyarazi n’imbaraga za mekanike, umuringa utanga icyizere cyiza mu gihe kirekire mu bihe bitandukanye by’ubushyuhe n’ubucucike bw’amashanyarazi. Byongeye kandi, ubushobozi bwinshi bw’umuringa bwo gutwara ubushyuhe bufasha gusohora vuba ubushyuhe buturuka mu gihe cy’ikoreshwa rya chips ku gice cy’ubushyuhe cyangwa ku gikoresho cy’ubushyuhe, bikongera ubushobozi bwo gucunga ubushyuhe bw’aho gipakira.
• Ibikoresho bya Lead Frame: Ifosholo y'umuringaikoreshwa cyane mu gupfunyika icyuma gifunga icyuma, cyane cyane mu gupfunyika igikoresho cy'amashanyarazi. Igipfunyika gitanga inkunga y'imiterere n'ihuza ry'amashanyarazi kuri chip, bisaba ibikoresho bifite ubushobozi bwo gutwara amashanyarazi menshi n'ubushobozi bwiza bwo gutwara amashanyarazi. Igipfunyika cy'umuringa cyujuje ibi bisabwa, bigabanya ikiguzi cyo gupfunyika mu buryo bunoze kandi binoza uburyo ubushyuhe bukwirakwira n'imikorere y'amashanyarazi.
• Ubuhanga bwo kuvura ubuso: Mu bikorwa bifatika, foil y'umuringa ikunze kuvurwa hejuru nko gupfunyika nikeli, tini, cyangwa feza kugira ngo hirindwe ogisijeni no kunoza ubushobozi bwo gusonerwa. Ubu buryo bwo kuvura burushaho kongera kuramba no kwizera foil y'umuringa mu gupfunyikamo icyuma cy'umuringa.
• Ibikoresho biyobora amashanyarazi muri Multi-Chip Modules: Ikoranabuhanga rya sisitemu rihuza utubumbe twinshi n'ibice bidakora mu ipaki imwe kugira ngo habeho ubufatanye bwinshi n'ubucucike bw'imikorere. Ifu y'umuringa ikoreshwa mu gukora imiyoboro y'imbere ihuza ibintu kandi igakora nk'inzira y'amashanyarazi. Iyi porogaramu isaba ko fu y'umuringa igira imikorere myiza kandi ikagira imiterere yoroshye cyane kugira ngo igere ku musaruro mwiza mu mwanya muto wo gupakira.
• Porogaramu za RF na Millimeter-Wave: Ifuru y'umuringa ifite kandi uruhare runini mu miyoboro y'amajwi yohereza amajwi mu buryo bwa SiP, cyane cyane mu miyoboro ya radiyo (RF) na millimetero-wave. Imiterere yayo yo gutakaza bike hamwe n'ubushobozi bwayo bwo gutwara amajwi bituma igabanya uburyo amajwi agabanuka neza kandi ikanoza imikorere myiza yo kohereza amajwi muri ubwo buryo bwa radiyo.
• Ikoreshwa mu gukwirakwiza (RDL): Mu gupakira umwotsi uvamo umuyaga, icyuma gifunga umuringa gikoreshwa mu kubaka urwego rwo gukwirakwiza, ikoranabuhanga rikwirakwiza chip I/O mu gace kanini. Kuba icyuma gifunga umuringa gifite ubushobozi bwo gutwara ibintu byinshi no gufata neza icyuma gifunga umuringa bituma kiba ibikoresho byiza byo kubaka urwego rwo gukwirakwiza ibintu, byongera ubucucike bwa I/O no gushyigikira guhuza multi-chip.
• Kugabanya Ingano n'Ubuziranenge bw'Ibisobanuro: Gukoresha foil y'umuringa mu bice bikwirakwiza bifasha kugabanya ingano y'ibipaki mu gihe binoza uburyo bwo kohereza amajwi n'umuvuduko, ibi bikaba ari ingenzi cyane mu bikoresho bigendanwa na mudasobwa zikora neza cyane zisaba gupakira ibintu bito kandi imikorere yabyo ikaba myiza.
• Ibikoresho byo gushyushya by'umuringa n'imiyoboro y'ubushyuhe: Bitewe n'uburyo ikoresha ubushyuhe bwinshi, foil y'umuringa ikunze gukoreshwa mu byuma bishyushya, imiyoboro y'ubushyuhe, n'ibikoresho bihuza ubushyuhe biri mu bipfunyika bya chip kugira ngo bifashe kwimura ubushyuhe buva muri chip mu buryo bwihuse mu byuma bikonjesha byo hanze. Iyi porogaramu ni ingenzi cyane mu byuma bishyushya cyane n'ibipaki bisaba kugenzura ubushyuhe neza, nka CPU, GPU, na chips zo gucunga ingufu.
• Ikoreshwa mu ikoranabuhanga rya Through-Silicon Via (TSV): Mu ikoranabuhanga ryo gupakira utubumbe twa 2.5D na 3D, utuntu tw'umuringa dukoreshwa mu gukora ibikoresho byo kohereza utuntu dukoresha ibyuma binyuzwa kuri silicon, bigatanga uburyo bwo guhuza utubumbe duto. Kuba utuntu tw'umuringa dutwara utuntu twinshi kandi dushobora gucukurwa neza bituma tuba ibikoresho bikunzwe muri ubu buryo bwo gupakira bugezweho, bushyigikira uburyo bwo gushyira hamwe ibintu byinshi n'inzira ngufi z'ibimenyetso, bityo bikanongera imikorere ya sisitemu muri rusange.

2. Pakingi ya Flip-Chip

3. Gupakira icyuma gifunga ...

4. Sisitemu iri muri Pake (SiP)

5. Pakingi yo Gusohora Umuyaga

6. Uburyo bwo gucunga ubushyuhe n'uburyo bwo gukwirakwiza ubushyuhe

7. Ikoranabuhanga rigezweho ryo gupakira (nk'ipaki ya 2.5D na 3D)

Muri rusange, ikoreshwa rya foil y'umuringa mu gupfunyika kwa chip ntabwo rigarukira gusa ku miyoboro gakondo yo kuyobora no gucunga ubushyuhe ahubwo rigera no ku ikoranabuhanga rishya ryo gupfunyika nka flip-chip, system-in-package, fan-out packing, na 3D packing. Imiterere myinshi y'imikorere n'imikorere myiza ya foil y'umuringa bigira uruhare runini mu kunoza ubwizerwe, imikorere, n'uburyo ihendutse bwo gupfunyika kwa chip.