Ese bigenda birushaho gupakira chip kubera imishinga y'amashanyarazi, imyitwarire yubushyuhe, itunganya, hamwe nibiciro-byiza. Here is a detailed analysis of its specific applications in chip packaging:

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• : Ubusanzwe, insinga za zahabu cyangwa aluminium zakoreshejwe mu gupakira chip kugirango uhuze amashanyarazi imbere yumuzunguruko wimbere muri chip kugeza hanze. Ariko, hamwe niterambere ryikoranabuhanga ryo gutunganya hamwe nibitekerezo bya sofée, umuyoboro wumuringa hamwe numugozi wumuringa bigenda bihinduka amahitamo akomeye. Umuryango wumuringa ni 85-95% wa zahabu, ariko igiciro cyacyo kijyanye na kimwe cya cumi, kikahitamo neza imikorere yimikorere minini nubukungu.
• : Amarira yumuringa atanga uburyo bwo kurwanya hasi hamwe nubucuruzi bwiza muburyo bwo hejuru-inshuro nyinshi, kugabanya imbaraga zo gutakaza imbaraga mumikoranire ya chip no kunoza imikorere yamashanyarazi. Thus, using copper foil as a conductive material in bonding processes can enhance packaging efficiency and reliability without increasing costs.
• : Mu gupakira flip-chip, chip ihindurwa kugirango yinjize / ibisohoka (i / o) padi yacyo ihujwe na pake kumurongo wa paki. Copper foil is used to make electrodes and micro-bumps, which are directly soldered to the substrate. The low thermal resistance and high conductivity of copper ensure efficient transmission of signals and power.
• : Bitewe no kurwanya ibyiza bya electrotions hamwe nimbaraga za mashini, umuringa gatanga ubwishingizi bwiza bwigihe kirekire mubihe byumuyaga mwinshi hamwe nubucucike bwa none. Byongeye kandi, umuyoboro muremure wumuringa ufasha ubushyuhe bwihuse mugihe cyakozwe mugihe cya Chip kuri substrate cyangwa ubushyuhe, kuzamura ubushobozi bwubushyuhe bwa paki.
• : is widely used in lead frame packaging, especially for power device packaging. Ikadiri yo kuyobora itanga inkunga yubatswe hamwe namashanyarazi kuri chip, bisaba ibikoresho hamwe nudutsiko two hejuru hamwe nubushyuhe bwiza. Copper foil meets these requirements, effectively reducing packaging costs while improving thermal dissipation and electrical performance.
• : Mubyiciro bifatika, fili yuzuye inkingi akenshi ihura nubuvuzi nka nikel, amabati, cyangwa ifeza yo gukumira okiside no kunoza umutware. These treatments further enhance the durability and reliability of copper foil in lead frame packaging.
• : Gukora sisitemu ya sisitemu bihuza ibice byinshi nibigize parike muri paki imwe kugirango ugere ku kwishyira hamwe no gucuranga imikorere. Copper foil is used to manufacture internal interconnecting circuits and serve as a current conduction path. Iyi porogaramu isaba umuringa kugirango ikore neza kandi ultra-ntoya ibiranga kugirango ugere kubikorwa byinshi muburyo bwo gupakira.
• : Amavuta y'umuringa nayo akina uruhare rukomeye mu muzunguruko wohererezanyaga hejuru y'ikimenyetso muri SIP, cyane cyane muri radiyo (RF) na milimetero) na porogaramu. Ibitaramo byo gutakaza bike hamwe nubwishingizi buhebuje bwemerera kugabanya ibimenyetso byerekana neza no kunoza imikorere yo kwanduza muri aya mahugurwa menshi.
• : In fan-out packaging, copper foil is used to construct the redistribution layer, a technology that redistributes chip I/O to a larger area. Imyitwarire minini kandi nziza yumusanzu ituma ibikoresho byiza byo kubaka ibice byo kugabura, byongera i / o kubaga no gushyigikira kwishyira hamwe kwinshi.
• : Gushyira mu bikorwa umuringa mu rwego rwo kugabura gutanga bifasha ingano mu gihe kuzamura ubusumbane bw'ikimenyetso n'umuvuduko, bikaba ngombwa cyane mu bikoresho bigendanwa hamwe n'ibikoresho byo mu rwego rwo kubara hamwe n'imikorere minini.
• : Kubera imyitwarire myiza yubushyuhe, fiil foil ikunze gukoreshwa mubushyuhe, imiyoboro yubushyuhe, ibikoresho byimiterere yubushyuhe muri chip yapabukiwe na chip yohereza vuba na chip imiterere yo gukonjesha. Iyi porogaramu ni ingenzi cyane cyane mu mpinja zisumbuye n'ibipaki bisaba kugenzura ubushyuhe busobanutse, nka CPU, GPU, na chip yo gucunga amashanyarazi.
• : Muri 2.5d na 3d Chip Paupagents, fip ya Fopper ikoreshwa mugukora ibintu byuzuza ibikoresho binyuze muri-silicon vias, itanga imikoranire ihagaritse hagati ya chip. Imyitwarire minini kandi itunganya umuyoboro wumuringa utuma ibikoresho byatoranijwe muri tekinoloji yo gupfunyika yateye imbere, gushyigikira guhuza ubwinshi hamwe ninzira ngufi yerekana imikorere rusange.

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Muri rusange, gusaba umuringa mu gupakira chip ntabwo bigarukira ku mikorere gakondo no gucunga ubushyuhe buhoro buhoro ahubwo bigera kuri flip-chip, sisitemu-yapakiye, hamwe na 3D. Imitungo myinshi n'imikorere myiza yumusari wumuringa ifite uruhare runini mugutezimbere kwizerwa, imikorere, hamwe nibikorwa byigihe gito.