Ibicuruzwa
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Civen specifically for the lithium battery manufacturing industry. Iyi fipper ya electrolytic ifite ibyiza byo kwisuku, umwanda muto, hejuru neza, hejuru, ubuso bumwe, no gutwikira kimwe, no guhinga byoroshye. Hamwe nisuku ryinshi hamwe na hydrophilic nziza, umuringa wa electrolytic, igorofa ya electrolytic ya bateri irashobora kongera amafaranga no gusohora no kwagura ubuzima bwa bateri. Muri icyo gihe,Civen
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Civen roughness and high peel strength. Umuringa wakozwe na FIRPOLYS HAMWE N'INGENZI Ifite ibyiza byo kwezwa hejuru, umwanda muto, ubuso bworoshye, imiterere yimbere, n'ubugari bunini. The electrolytic copper foil can be better laminated with other materials after roughening on one side, and it is not easy to peel off.
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electrolytic copper foil is a copper foil that has been roughened to varying degrees on both sides. Ibi bishimangira imbaraga zimpande zombi zumuringa wumuringa, byoroshye gukoresha nkigice kinini cyo guhuza ibindi bikoresho. Moreover, the different levels of treatment on both sides of the copper foil make it easier to etch the thinner side of the roughened layer. In the process of making a printed circuit board (PCB) panel, the treated side of the copper is applied to the dielectric material. The treated drum side is rougher than the other side, which constitutes a greater adhesion to the dielectric. This is the main advantage over standard electrolytic copper. The matte side does not require any mechanical or chemical treatment prior to the application of photoresist. It is already rough enough to have good laminating resist adhesion.
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Umuringa Umuringas. At the same time, the surface finish and fineness of the copper foil is better and the folding resistance isbetter than similar copper foil products. Kubera ko iyi foul yumuringa ishingiye kumikorere ya electrolytic, ntabwo ikubiyemo amavuta, bituma byoroshye guhuzwa nibikoresho bya TPI ku bushyuhe bwo hejuru.
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Civen Ntabwo ufite imyitozo myiza y'amashanyarazi gusa kubera isuku ndende y'umuringa, ariko nanone biroroshye kuri ETCH kandi birashobora kuba umudendezi neza ibimenyetso bya elecromagnetic na microwave. Inzira ya electrolytic ituma ubugari ntarengwa bwa metero 1.2 cyangwa nyinshi, yemerera porogaramu byoroshye mumirima itandukanye. The copper foil itself has a very flat shape and can be perfectly molded to other materials. Umuringa kandi urwanya okiside yubushyuhe bwinshi hamwe na ruswa, bigatuma bikwiranye no gukoresha ibidukikije bikaze cyangwa kubicuruzwa bifite ubuzima bubi.
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Icyuma cya Nikel gifite umutekano mwinshi mu kirere, ubushobozi bukomeye bwo kwitondera, burashobora kurwanya ruswa ya alkali na acide, ku buryo ibicuruzwa bihamye, bidashoboka ko hashobora kubaho ibidukikije hejuru ya 600℃; nickel plating layer has strong adhesion, not easy to fall off; Igicuruzwa cya Nikel kirashobora gukora hejuru yibintu, birashobora kunoza ibicuruzwa byambara ihohoterwa na aside hamwe na aside
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Ibicuruzwa by'umuringa byagaragaye mu kirere bikunda kuri okiside no gushiraho karubone yibanze yumuringa, ifitirwa, imikorere mibi y'amashanyarazi n'uburyo bwo kwandura amashanyarazi; after tin plating, copper products form tin dioxide films in the air due to the properties of tin metal itself to prevent further oxidation.